Since established in 1989, Sanwa Laboratory
Is pioneer OSP product and sales.
We have a lot of “ CuCoat ” usersall over the world
since 1990.
What is OSP?? (OSP : Organic Solder-ability Preservative)
OSP is water based surface treatment product for PCB before SMT to protect Cupper surface ( unti-corrosion, heat resitance, keep soder-ability etc.), due Imidazole derived compound form OSP layer on Cupper surface.
Sanwa achieved improvement of heat resistance performance of OSP (CuCoat), due to developing of Alkylbenzimidazole derived compound.
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Fig.1 Imidazole derived compound
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Fig.2 Alkylbenzimidazole derived compound
CuCoat series has various characteristics as follow,
- ・Heat resistance after multiple thermal excursions
- ・Supported ICT(In circuit test)
- ・Suppression of Galvanic effect
- ・1 step treatment type, 2 step type.
- ・Easy to Line maintenance
- ・Treatment of Au/Cu Print circuit board (Selective type) etc.
We will suggest suitable product as to requirement, OSP line condition and others.
If you need more detail information, please contact us through “ Contact Form ”.
About Us
Company Profile
- Trade Name
- Sanwa Laboratory Ltd.
- Head Office
- Toranomon Towers Office, 1-28, Toranomon 4-chome,Minato-ku,
Tokyo 105-8451, Japan
TEL: +81-3-3432-7031 FAX: +81-3-3432-3531 - Establishment
- Nov. 1989
- Capital
- JPY10,000,000.-
- Director
- Toshio Kobayashi
- Description of Business
- Production and Sale of OSP products
Company History
| 1989.11 | : | Established on a capital of JPY6,000,000 to attain the objects mentioned above. |
|---|---|---|
| 1990.6 | : | Exhibited “Water-Based Pre-flux (OSP) CuCoat”, heat-resistant, for SMT on JPCA Show, made it public, and started its sales. |
| 1990.8 | : | Joined by Morimura, Inc. and increased its capital to JPY10,000,000. |
| 1991.11 | : | HITACH TELECOM TECHNOLOGIES,LTD. and Nihon Electric Company published papers on “CuCoat to the Print Circuit Society in its 6th lecture meeting. |
| 1992.3 | : | “The 4th Prize for Excellent, New Technology and New Product in the small/medium enterprises” was awarded to “CuCoat”, our main product. Also our contribution was recognized publicly by THE KYOWA BANK FOUNDATION and THE NIKKAN KOGYO SHIMBUN. |
| 1994.8 | : | Head office moved to the present address: 35-1 Yayoi-cho, Itabashi-ward, Tokyo |
| 2001.6 | : | “SNW-SYSTEM”, our newly developed etching system and “HOLE-COAT” to be used for the system, were unveiled and started its sample shipping. |
| 2002.1 | : | Developed Pb-free OSP CuCoat V-Series and started its marketing. |
| 2014.4 | : | Head office moved to the present address: Morimura Bldg., 3-1, Toranomon 1-chome, Minato-ku, Tokyo |
| 2016.5 | : | Head office moved to the present address: Toranomon Towers Office, 1-28, Toranomon 4-chome, Minato-ku, Tokyo |
| Now | : | New generation OSP product under development |