Sanwa Laboratory Is pioneer OSP product and sales

Since established in 1989, Sanwa Laboratory
Is pioneer OSP product and sales.
We have a lot of “ CuCoat ” usersall over the world
since 1990.

What is OSP?? (OSP : Organic Solder-ability Preservative)

OSP is water based surface treatment product for PCB before SMT to protect Cupper surface ( unti-corrosion, heat resitance, keep soder-ability etc.), due Imidazole derived compound form OSP layer on Cupper surface.

Sanwa achieved improvement of heat resistance performance of OSP (CuCoat), due to developing of Alkylbenzimidazole derived compound.

  • Imidazole derived compound

    Fig.1 Imidazole derived compound

  • Alkylbenzimidazole derived compound

    Fig.2 Alkylbenzimidazole derived compound

CuCoat series has various characteristics as follow,

  • ・Heat resistance after multiple thermal excursions
  • ・Supported ICT(In circuit test)
  • ・Suppression of Galvanic effect
  • ・1 step treatment type, 2 step type.
  • ・Easy to Line maintenance
  • ・Treatment of Au/Cu Print circuit board (Selective type) etc.

We will suggest suitable product as to requirement, OSP line condition and others.
If you need more detail information, please contact us through “ Contact Form ”.

About Us

Company Profile

Trade Name
Sanwa Laboratory Ltd.
Head Office
Toranomon Towers Office, 1-28, Toranomon 4-chome,Minato-ku,
Tokyo 105-8451, Japan
TEL: +81-3-3432-7031 FAX: +81-3-3432-3531
Nov. 1989
Toshio Kobayashi
Description of Business
Production and Sale of OSP products

Company History

1989.11:Established on a capital of JPY6,000,000 to attain the objects mentioned above.
1990.6:Exhibited “Water-Based Pre-flux (OSP) CuCoat”, heat-resistant, for SMT on JPCA Show, made it public, and started its sales.
1990.8:Joined by Morimura, Inc. and increased its capital to JPY10,000,000.
1991.11:HITACH TELECOM TECHNOLOGIES,LTD. and Nihon Electric Company published papers on “CuCoat to the Print Circuit Society in its 6th lecture meeting.
1992.3:“The 4th Prize for Excellent, New Technology and New Product in the small/medium enterprises” was awarded to “CuCoat”, our main product. Also our contribution was recognized publicly by THE KYOWA BANK FOUNDATION and THE NIKKAN KOGYO SHIMBUN.
1994.8:Head office moved to the present address: 35-1 Yayoi-cho, Itabashi-ward, Tokyo
2001.6:“SNW-SYSTEM”, our newly developed etching system and “HOLE-COAT” to be used for the system, were unveiled and started its sample shipping.
2002.1:Developed Pb-free OSP CuCoat V-Series and started its marketing.
2014.4:Head office moved to the present address: Morimura Bldg., 3-1, Toranomon 1-chome, Minato-ku, Tokyo
2016.5:Head office moved to the present address: Toranomon Towers Office, 1-28, Toranomon 4-chome, Minato-ku, Tokyo
Now:New generation OSP product under development